In the advanced materials field, we have combined our unique creativity with advanced technology to develop very special materials such as highly heat-resistant, wholly aromatic polyimides, and amorphous carbon. In addition to lightweight and heat-resistant polyimide foam, polyimide varnish is now used as a material for FPC (flexible printed circuit) boards. Materials with unique functionality and limitless potential, such as glass fibers and amorphous metals, are extremely popular in the field of information and electronic devices as well as for other applications that require ever smaller and lighter materials. Our ability to develop advanced technologies supports the practicality of our products in this niche market.