High heat resistance, flexibility, low dielectric properties
Imide-based epoxy curing agent
It contributes to improving the performance of your epoxy resin.
A new imide-based epoxy curing agent have been developed by Unitika's original manufacturing process.
It solves the problems of epoxy resin used for electronic parts in the high temperature range and contributes to the improvement of the performance of your epoxy resin.
Features
- ・Heat-resistant
High heat resistance is achieved by introducing imide group into the epoxy curing system. - ・Low dielectric properties
It is ideal for use in the electronics field. - ・Applicability
It can also be applied to improve the characteristics of your existing epoxy curing system. - ・Flexibility
Heat resistant type and flexible type are available.
By using them together, ideal characteristics are expressed.
Imide group can be introduced into epoxy curing systems
By using them together,
it is possible to achieve both heat resistance and shape stability.
Heat resistant type
High heat resistance, high toughness (high strength), low dielectric properties
High performance was achieved with low crosslink density by introducing imide group.
High insulation (By joint study with Tokyo City University)
Flexible type
Excellent flexibility (low elastic modulus & high elongation), low dielectric properties
Shape stability of epoxy cured product (prevention of cracking, warping and peeling)
The above characteristics are achieved by introducing flexible chemical structure.
General properties
| Curing agent | Heat resistant type | Heat resistant type / Flexible type*2 | Heat resistant type | PN*3 | PN / Heat resistant type*2,3 | ||
|---|---|---|---|---|---|---|---|
| Properties | Appearance | Yellow powder | ー | Yellow liquid | ー | ー | |
| Functional group equivalent | g/eq | 274 | ー | 1510 | 104 | ー | |
| Characteristics of cured epoxy resin *1 | Tensile strength | MPa | 96 | 67 | 3 | 54 | 42 |
| Tensile elongation | % | 9 | 10 | 358 | 2 | 4 | |
| Tg (DMA) | ℃ | 223 | 212 | 14 | 132 | 128 | |
| E’ (DMA) | MPa | 2730 | 1970 | 3 | 2765 | 1639 | |
| Dielectric constant DK*4 | - | 3.05 | 2.91 | 2.21 | 3.08 | 2.86 | |
| Dielectric dissipation factor Df*4 | - | 0.014 | 0.011 | 0.007 | 0.033 | 0.027 | |
| CTE *5 | 10-6/℃ | 57 | 86 | 1632*7 | 70 | 81 | |
| Td5*6 | ℃ | 385 | 380 | 314 | 369 | 369 | |
- *1 Epoxy resin : BADGE (Bisphenol A Diglycidyl Ether), Accelerator : 2-Ethyl-4-methylimidazole (2E4Mz) 0.2wt%, Mixing ratio : Epoxy resin / Curing agent = 1/1 (Functional group equivalent ratio), Curing condition : 120°C 1h → (22.5°C/h) →300°C 1h
- *2 The ratio of the flexible type to the resin solid content was set to 15wt%.
- *3 PN : Phenol novolac hardener
- *4 Cavity perturbation method (5.8GHz)
- *5 50〜100°C
- *6 Air atmosphere
- *7 20～50°C
Catalog
PDF Download (0.9MB)< June 01, 2023 >