Soft Super Engineering Plastic Film
Low Modulus
Heat Resistant Film
This is a new type of polyamide film
that achieves both flexibility and heat resistance,
which has been considered difficult
with conventional films.
Features
- ・Made from Unitika’s unique polyamide resin
- ・Low modulus and heat resistant functional film
- ・Excellent in electrical characteristics and bending resistance
- ・Excellent in adhesion and chemical resistance
Performance balance
Stress-Strain curve
Basic properties
| Items | Unit | Low Modulus Heat Resistant Film | |
|---|---|---|---|
| Thickness | μm | 25 | 80 |
| Tensile elastic modulus | GPa | 1.7 | 1.1 |
| Tensile elongation | % | 100 | 300 |
| Tensile strength | MPa | 110 | 60 |
| Heat shrinkage 250℃×5min | % | 2.0 | 1.5 |
Thermal properties
| Test condition | Result |
|---|---|
| 260℃×1min (On hot plate) | No change |
Dielectric characteristics
| Items | Low modulus Heat Resistant Film | MPI | LCP |
|---|---|---|---|
| Dielectric constant | 2.7 | 3.7 | 3.3 |
| Dielectric dissipation factor | 0.005 | 0.005 | 0.002 |
Cavity perturbation method: 5.8 GHz, 23℃ 50%RH
Transmission loss
Applications
- · for semiconductor back-end processing
- · Heat-resistant release film
- · Flexible Cover layer
- · Stretchable FPC
- etc.
< Semiconductor industry >
< Circuit board industry >
Catalog
PDF Download (1.8MB)< March 23, 2022 >